8th International Conference On Technological Advances Of Thin Films and Surface Coatings

Verbundene Inhalte

• Veröffentlichungen und Abschlussarbeiten

• Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers

  Publikation: Konferenzbeitrag › Vortrag › Forschung