3D simulation of interdendritic flow through a Al-18wt.%Cu structure captured with X-ray microtomography

Titel in Übersetzung: 3D simulation of interdendritic flow through a Al-18wt.%Cu structure captured with X-ray microtomography

Publikation: Konferenzbeitrag › Poster › Forschung › Begutachtung

7 Zitate (Scopus)

Titel in Übersetzung	3D simulation of interdendritic flow through a Al-18wt.%Cu structure captured with X-ray microtomography
Originalsprache	Englisch
Publikationsstatus	Veröffentlicht - 2011
Veranstaltung	Third International Conference on Advances in Solidification Processes - Rolduc Abbey, Kerkrade, Niederlande Dauer: 7 Juni 2011 → 10 Juni 2011

Konferenz	Third International Conference on Advances in Solidification Processes
Kurztitel	ICASP 3
Land/Gebiet	Niederlande
Ort	Kerkrade
Zeitraum	7/06/11 → 10/06/11

Dieses zitieren

@conference{874a81329822472eb5a03cf1e4c0809b,

title = "3D simulation of interdendritic flow through a Al-18wt.\%Cu structure captured with X-ray microtomography",

author = "Josef Domitner and Christian H{\"o}lzl and Abdellah Kharicha and Menghuai Wu and Andreas Ludwig and Markus K{\"o}hler and Lorenz Ratke",

year = "2011",

language = "English",

note = "Third International Conference on Advances in Solidification Processes (ICASP 3) ; Conference date: 07-06-2011 Through 10-06-2011",

}

3D simulation of interdendritic flow through a Al-18wt.%Cu structure captured with X-ray microtomography. / Domitner, Josef; Hölzl, Christian; Kharicha, Abdellah et al.
2011. Postersitzung präsentiert bei Third International Conference on Advances in Solidification Processes, Kerkrade, Niederlande.

Publikation: Konferenzbeitrag › Poster › Forschung › Begutachtung

TY - CONF

T1 - 3D simulation of interdendritic flow through a Al-18wt.%Cu structure captured with X-ray microtomography

AU - Domitner, Josef

AU - Hölzl, Christian

AU - Kharicha, Abdellah

AU - Wu, Menghuai

AU - Ludwig, Andreas

AU - Köhler, Markus

AU - Ratke, Lorenz

PY - 2011

Y1 - 2011

M3 - Poster

T2 - Third International Conference on Advances in Solidification Processes (ICASP 3)

Y2 - 7 June 2011 through 10 June 2011

ER -