@inproceedings{4ec9c7a67d6642099e3b5550dd8c168c,
title = "A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies",
keywords = "Criticality Assessment, Finite Element Analysis (FEA), Microelectronics, Microvia, Printed Circuit Board Assembly (PCBA), Reliability, Via",
author = "Kamble, \{Vikram G.\} and Patel, \{Dhaval Rasheshkumar\} and Christian Schipfer and Andreas Thalhamer and Julia Zuendel and Thomas Krivec and Thomas Antretter and Fuchs, \{Peter Filipp\}",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 ; Conference date: 07-04-2024 Through 10-04-2024",
year = "2024",
doi = "10.1109/EuroSimE60745.2024.10491487",
language = "English",
isbn = "9798350393637",
series = "2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024",
address = "United States",
}