A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

A. Thalhamer, P. Fuchs, L. Strohmeier, S. Hasil, A. Wolfberger

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

OriginalspracheEnglisch
Titel2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
ISBN (elektronisch)9781665458368
DOIs
PublikationsstatusVeröffentlicht - 2022
Veranstaltung23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 - St Julian, Malta
Dauer: 25 Apr. 202227 Apr. 2022

Publikationsreihe

Name2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

Konferenz

Konferenz23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Land/GebietMalta
OrtSt Julian
Zeitraum25/04/2227/04/22

Bibliographische Notiz

Funding Information:
The research work was performed within the COMET-Module project “Chemitecture” (project-no.: 21647048) at the Polymer Competence Center Leoben GmbH (PCCL, Austria) within the framework of the COMET-program of the Federal Ministry for Transport, Innovation and Technology and the Federal Ministry for Digital and Economic Affairs with contributions by Montanuniversität Leoben, Technische Universität Dortmund, BTO-Epoxy GmbH, In-Vision Technologies AG and TDK Electronics AG. The PCCL is funded by the Austrian Government and the State Governments of Styria, Lower Austria and Upper Austria.

Publisher Copyright:
© 2022 IEEE.

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