A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

A. Thalhamer; P. Fuchs; L. Strohmeier; S. Hasil; A. Wolfberger

doi:10.1109/EuroSimE54907.2022.9758869

A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

A. Thalhamer
, P. Fuchs
, L. Strohmeier
, S. Hasil
, A. Wolfberger

Polymer Competence Center Leoben GmbH

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Originalsprache	Englisch
Titel	2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Herausgeber (Verlag)	Institute of Electrical and Electronics Engineers
ISBN (elektronisch)	9781665458368
DOIs	https://doi.org/10.1109/EuroSimE54907.2022.9758869
Publikationsstatus	Veröffentlicht - 2022
Veranstaltung	23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 - St Julian, Malta Dauer: 25 Apr. 2022 → 27 Apr. 2022

Publikationsreihe

Name	2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

Konferenz

Konferenz	23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Land/Gebiet	Malta
Ort	St Julian
Zeitraum	25/04/22 → 27/04/22

Bibliographische Notiz

Funding Information:
The research work was performed within the COMET-Module project “Chemitecture” (project-no.: 21647048) at the Polymer Competence Center Leoben GmbH (PCCL, Austria) within the framework of the COMET-program of the Federal Ministry for Transport, Innovation and Technology and the Federal Ministry for Digital and Economic Affairs with contributions by Montanuniversität Leoben, Technische Universität Dortmund, BTO-Epoxy GmbH, In-Vision Technologies AG and TDK Electronics AG. The PCCL is funded by the Austrian Government and the State Governments of Styria, Lower Austria and Upper Austria.

Publisher Copyright:
© 2022 IEEE.

Zugriff auf Dokument

10.1109/EuroSimE54907.2022.9758869

Andere Dateien und Links

Verknüpfung zur Publikation in Scopus

Dieses zitieren

Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S., & Wolfberger, A. (2022). A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE54907.2022.9758869

Thalhamer, A. ; Fuchs, P. ; Strohmeier, L. et al. / A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

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Thalhamer, A, Fuchs, P, Strohmeier, L, Hasil, S & Wolfberger, A 2022, A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022, Institute of Electrical and Electronics Engineers, 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022, St Julian, Malta, 25/04/22. https://doi.org/10.1109/EuroSimE54907.2022.9758869

A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. / Thalhamer, A.; Fuchs, P.; Strohmeier, L. et al.
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

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AU - Thalhamer, A.

AU - Fuchs, P.

AU - Strohmeier, L.

AU - Hasil, S.

AU - Wolfberger, A.

PY - 2022

Y1 - 2022

UR - https://www.scopus.com/pages/publications/85129524836

U2 - 10.1109/EuroSimE54907.2022.9758869

DO - 10.1109/EuroSimE54907.2022.9758869

M3 - Conference contribution

AN - SCOPUS:85129524836

T3 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

BT - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

PB - Institute of Electrical and Electronics Engineers

T2 - 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

Y2 - 25 April 2022 through 27 April 2022

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Thalhamer A, Fuchs P, Strohmeier L, Hasil S, Wolfberger A. A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers. 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). doi: 10.1109/EuroSimE54907.2022.9758869