@article{9fbfe916ef7a46dbbce906469601b439,
title = "Advanced characterisation of thermo-mechanical fatigue mechanisms of different copper film systems for wafer metallizations",
keywords = "Copper metallization, Inorganic impurities, Small angle grain boundary formation, Surface roughening, Thermo-mechanical fatigue, Twin boundary migration, Void formation",
author = "Stephan Bigl and Stefan Wurster and Megan Cordill and Daniel Kiener",
year = "2016",
month = aug,
day = "1",
doi = "10.1016/j.tsf.2016.05.044",
language = "English",
volume = "612.2016",
pages = "153--164",
journal = "Thin solid films",
issn = "0040-6090",
publisher = "Elsevier B.V.",
number = "1 August",
}