Analyzing Thermal Conductivity of Polyethylene‐Based Compounds Filled with Copper

Helena Weingrill; Wolfgang Hohenauer; Katharina Resch-Fauster; Christoph Zauner

doi:10.1002/mame.201800644

Analyzing Thermal Conductivity of Polyethylene‐Based Compounds Filled with Copper

Helena Weingrill, Wolfgang Hohenauer, Katharina Resch-Fauster, Christoph Zauner

Lehrstuhl für Werkstoffkunde und Prüfung der Kunststoffe (210)

Austrian Institute of Technology, Wien

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Begutachtung

5 Zitate (Scopus)

Abstract

The thermal conductivity (TC) of different polymeric materials is measured via four commercially available testing devices: TPS2500S by Hot Disk (Hot Disk), Transient Hot Bridge (THB) by Linseis, the Laser Flash Analysis (LFA) by NETZSCH, and the DTC‐300 by TA Instruments. The investigated materials include high‐density polyethylene (HDPE) and linear low‐density polyethylene (LLDPE) which are analyzed as received and after being compounded with copper particles. The filler geometry and ratio are varied systematically. Major differences in the TC generated by the different measurement methods are revealed and analyzed in detail. Moreover, material‐induced impacts on the TC as well as technology‐induced impacts on the TC are outlined comprehensively.

Originalsprache	Englisch
Aufsatznummer	1800644
Fachzeitschrift	Macromolecular materials and engineering
Jahrgang	304.2019
Ausgabenummer	4
DOIs	https://doi.org/10.1002/mame.201800644
Publikationsstatus	Veröffentlicht - 9 Jan. 2019

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10.1002/mame.201800644

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abstract = "The thermal conductivity (TC) of different polymeric materials is measured via four commercially available testing devices: TPS2500S by Hot Disk (Hot Disk), Transient Hot Bridge (THB) by Linseis, the Laser Flash Analysis (LFA) by NETZSCH, and the DTC‐300 by TA Instruments. The investigated materials include high‐density polyethylene (HDPE) and linear low‐density polyethylene (LLDPE) which are analyzed as received and after being compounded with copper particles. The filler geometry and ratio are varied systematically. Major differences in the TC generated by the different measurement methods are revealed and analyzed in detail. Moreover, material‐induced impacts on the TC as well as technology‐induced impacts on the TC are outlined comprehensively.",

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AB - The thermal conductivity (TC) of different polymeric materials is measured via four commercially available testing devices: TPS2500S by Hot Disk (Hot Disk), Transient Hot Bridge (THB) by Linseis, the Laser Flash Analysis (LFA) by NETZSCH, and the DTC‐300 by TA Instruments. The investigated materials include high‐density polyethylene (HDPE) and linear low‐density polyethylene (LLDPE) which are analyzed as received and after being compounded with copper particles. The filler geometry and ratio are varied systematically. Major differences in the TC generated by the different measurement methods are revealed and analyzed in detail. Moreover, material‐induced impacts on the TC as well as technology‐induced impacts on the TC are outlined comprehensively.

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