@article{7f340aa4833542f69465b4bcef7e6968,
title = "Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior",
keywords = "Au–Sn solder, Fracture toughness, Micro-bending, Micro-cantilever testing",
author = "Chaowei Du and Rafael Soeler and Bernhard V{\"o}lker and Kurt Matoy and Johannes Zechner and Gregor Langer and Michael Reisinger and Juraj Todt and Christoph Kirchlechner and Gerhard Dehm",
year = "2019",
month = dec,
day = "1",
doi = "10.1016/j.mtla.2019.100503",
language = "English",
volume = "8.2019",
journal = "Materialia",
issn = "2589-1529",
publisher = "Elsevier B.V.",
}