Bending Properties of Lightweight Copper Specimens with Different Infill Patterns Produced by Material Extrusion Additive Manufacturing, Solvent Debinding and Sintering

Joamin Gonzalez-Gutierrez, Santiago Cano Cano, Josef Valentine Ecker, Michael Kitzmantel, Florian Arbeiter, Christian Kukla, Clemens Holzer

Publikation: Beitrag in FachzeitschriftArtikelForschungBegutachtung

2 Zitate (Scopus)

Abstract

Material extrusion additive manufacturing (MEX) is a versatile technology for producing complex specimens of polymers, ceramics and metals. Highly-filled filaments composed of a binder system and a high-volume content of sinterable powders are needed to produce ceramic or metal parts. After shaping the parts via MEX, the binder is removed and the specimens are sintered to obtain a dense part of the sintered filler particles. In this article, the applicability of this additive manufacturing process to produce copper specimens is demonstrated. The particular emphasis is on investigating the production of lightweight specimens that retain mechanical properties without increasing their weight. The effect of infill grades and the cover presence on the debinding process and the flexural properties of the sintered parts was studied. It was observed that covers could provide the same flexural strength with a maximum weight reduction of approximately 23%. How-ever, a cover on specimens with less than 100% infill significantly slows down the debinding process. The results demonstrate the applicability of MEX to produce lightweight copper specimens.

OriginalspracheEnglisch
Aufsatznummer7262
FachzeitschriftApplied Sciences : open access journal
Jahrgang11
Ausgabenummer16
DOIs
PublikationsstatusVeröffentlicht - 6 Aug. 2021

Bibliographische Notiz

Funding Information:
Funding: This research was funded by the Austrian Research Promotion Agency (FFG), project 3DMulti-Mat, project number 875650. MDPI waived the APC for the editorial services of J.G.-G.

Publisher Copyright:
© 2021 by the authors. Licensee MDPI, Basel, Switzerland.

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