Characterization and modeling of a typical curing material for photoresist films

Chongnan Peng; Matthias Morak; Andreas Thalhamer; Mario Gschwandl; Peter Fuchs; Qi Tao; Thomas Krivec; Thomas Antretter; Miguel Angel Celigueta

doi:10.1109/EuroSimE54907.2022.9758849

Characterization and modeling of a typical curing material for photoresist films

Chongnan Peng, Matthias Morak, Andreas Thalhamer, Mario Gschwandl, Peter Fuchs, Qi Tao, Thomas Krivec, Thomas Antretter, Miguel Angel Celigueta

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Originalsprache	Englisch
Titel	2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Herausgeber (Verlag)	Institute of Electrical and Electronics Engineers
ISBN (elektronisch)	9781665458368
DOIs	https://doi.org/10.1109/EuroSimE54907.2022.9758849
Publikationsstatus	Veröffentlicht - 2022
Veranstaltung	23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 - St Julian, Malta Dauer: 25 Apr. 2022 → 27 Apr. 2022

Publikationsreihe

Name	2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

Konferenz

Konferenz	23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Land/Gebiet	Malta
Ort	St Julian
Zeitraum	25/04/22 → 27/04/22

Bibliographische Notiz

Funding Information:
The research work was performed within the COMET-project „MODELING AND SIMULATION OF LASER-CONTROLLED PROCESS AND MANUFACTURING TECHNIQUES“ (project-no.: VII-2.06) at the Polymer Competence Center Leoben GmbH (PCCL, Austria) within the framework of the COMET-program of the Federal Ministry for Climate Action, Environment, Energy, Mobility, Innovation and Technology and the Federal Ministry for Digital and Economic Affairs with contributions by Montanuniversitaet Leoben (Chair of Mechanics), International Center for Numerical Methods in Engineering (CIMNE) and AT&S Austria Technologie & Systemtechnik AG. The PCCL is funded by the Austrian Government and the State Governments of Styria, Lower Austria and Upper Austria.

Publisher Copyright:
© 2022 IEEE.

Zugriff auf Dokument

10.1109/EuroSimE54907.2022.9758849

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Dieses zitieren

Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T., & Celigueta, M. A. (2022). Characterization and modeling of a typical curing material for photoresist films. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE54907.2022.9758849

Peng, Chongnan ; Morak, Matthias ; Thalhamer, Andreas et al. / Characterization and modeling of a typical curing material for photoresist films. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

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author = "Chongnan Peng and Matthias Morak and Andreas Thalhamer and Mario Gschwandl and Peter Fuchs and Qi Tao and Thomas Krivec and Thomas Antretter and Celigueta, {Miguel Angel}",

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Peng, C, Morak, M, Thalhamer, A, Gschwandl, M, Fuchs, P, Tao, Q, Krivec, T, Antretter, T & Celigueta, MA 2022, Characterization and modeling of a typical curing material for photoresist films. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022, Institute of Electrical and Electronics Engineers, 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022, St Julian, Malta, 25/04/22. https://doi.org/10.1109/EuroSimE54907.2022.9758849

Characterization and modeling of a typical curing material for photoresist films. / Peng, Chongnan; Morak, Matthias; Thalhamer, Andreas et al.
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

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T1 - Characterization and modeling of a typical curing material for photoresist films

AU - Peng, Chongnan

AU - Morak, Matthias

AU - Thalhamer, Andreas

AU - Gschwandl, Mario

AU - Fuchs, Peter

AU - Tao, Qi

AU - Krivec, Thomas

AU - Antretter, Thomas

AU - Celigueta, Miguel Angel

PY - 2022

Y1 - 2022

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U2 - 10.1109/EuroSimE54907.2022.9758849

DO - 10.1109/EuroSimE54907.2022.9758849

M3 - Conference contribution

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T3 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

BT - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

PB - Institute of Electrical and Electronics Engineers

T2 - 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

Y2 - 25 April 2022 through 27 April 2022

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Peng C, Morak M, Thalhamer A, Gschwandl M, Fuchs P, Tao Q et al. Characterization and modeling of a typical curing material for photoresist films. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers. 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). doi: 10.1109/EuroSimE54907.2022.9758849