Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

Tiphaine Pélisset; Balamurugan Karunamurthy; Ralf Otremba; Thomas Antretter

Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

Titel in Übersetzung: Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

Tiphaine Pélisset, Balamurugan Karunamurthy, Ralf Otremba, Thomas Antretter

Lehrstuhl für Mechanik (400)

Publikation: Konferenzbeitrag › Poster › Forschung › Begutachtung

Titel in Übersetzung	Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
Originalsprache	Englisch
Publikationsstatus	Veröffentlicht - 2014
Veranstaltung	15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Gent, Belgien Dauer: 7 Apr. 2014 → 9 Apr. 2014

Konferenz

Konferenz	15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Kurztitel	EuroSimE 2014
Land/Gebiet	Belgien
Ort	Gent
Zeitraum	7/04/14 → 9/04/14

Dieses zitieren

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title = "Characterization and modeling of the AuSnCu thin solder joint under thermal cycling",

author = "Tiphaine P{\'e}lisset and Balamurugan Karunamurthy and Ralf Otremba and Thomas Antretter",

year = "2014",

language = "English",

note = "15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 ; Conference date: 07-04-2014 Through 09-04-2014",

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Characterization and modeling of the AuSnCu thin solder joint under thermal cycling. / Pélisset, Tiphaine; Karunamurthy, Balamurugan; Otremba, Ralf et al.
2014. Postersitzung präsentiert bei 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Gent, Belgien.

Publikation: Konferenzbeitrag › Poster › Forschung › Begutachtung

TY - CONF

T1 - Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

AU - Pélisset, Tiphaine

AU - Karunamurthy, Balamurugan

AU - Otremba, Ralf

AU - Antretter, Thomas

PY - 2014

Y1 - 2014

M3 - Poster

T2 - 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014

Y2 - 7 April 2014 through 9 April 2014

ER -