@inproceedings{15e425246d864bbf99faf0f2a57d88ff,
title = "Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process",
keywords = "Assembly process, Classical laminate theory, Fea, Interfacial model, Residual stress, Warpage",
author = "K. Macurova and \{Bermejo Moratinos\}, Raul and M. Pletz and R. Sch{\"o}ngrundner and T. Antretter and T. Krivec and M. Morianz and M. Brizoux and A. Lecavelier",
year = "2014",
month = jan,
day = "1",
language = "English",
isbn = "9780990902805",
pages = "355--360",
booktitle = "Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014",
publisher = "IMAPS-International Microelectronics and Packaging Society",
note = "47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014 ; Conference date: 13-10-2014 Through 16-10-2014",
}