Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

1 Zitat (Scopus)

Titel in Übersetzung	Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions
Originalsprache	Deutsch
Titel	15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Seiten	1-8
Publikationsstatus	Veröffentlicht - 2014

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@inproceedings{09b6b10d0374428fb3999a2f78b52ba5,

title = "Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions",

author = "Fuchs, \{Peter F.\} and Gerald Pinter and Thomas Krivec",

year = "2014",

language = "Deutsch",

pages = "1--8",

booktitle = "15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems",

}

Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions. / Fuchs, Peter F.; Pinter, Gerald; Krivec, Thomas.
15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. 2014. S. 1-8.

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

TY - GEN

T1 - Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions

AU - Fuchs, Peter F.

AU - Pinter, Gerald

AU - Krivec, Thomas

PY - 2014

Y1 - 2014

M3 - Beitrag in Konferenzband

SP - 1

EP - 8

BT - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

ER -