Design of multilayer metallization  to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers

Imane Souli; Velislava Terziyska; Jozef Keckes; Josef Zechner; Christian Mitterer

Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers

Imane Souli
, Velislava Terziyska
, Jozef Keckes
, Josef Zechner
, Christian Mitterer

Publikation: Konferenzbeitrag › Vortrag › Forschung

Originalsprache	Englisch
Publikationsstatus	Veröffentlicht - 2016
Veranstaltung	8th International Conference On Technological Advances Of Thin Films and Surface Coatings - Singapur, Singapur Dauer: 12 Juli 2016 → 15 Juli 2016

Konferenz

Konferenz	8th International Conference On Technological Advances Of Thin Films and Surface Coatings
Kurztitel	ThinFilms2016
Land/Gebiet	Singapur
Ort	Singapur
Zeitraum	12/07/16 → 15/07/16

8th International Conference On Technological Advances Of Thin Films and Surface Coatings
Souli, I. (Redner/-in)
12 Juli 2016 → 15 Juli 2016
Aktivität: Teilnahme an oder Organisation einer Veranstaltung › Konferenzteilnahme

Dieses zitieren

Souli, I., Terziyska, V., Keckes, J., Zechner, J., & Mitterer, C. (2016). Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers . 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapur.

Souli, Imane ; Terziyska, Velislava ; Keckes, Jozef et al. / Design of multilayer metallization to reduce mechanical loading : Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers . 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapur.

@conference{e4d57ba6f325420e96a05ad406fd8a86,

title = "Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers ",

author = "Imane Souli and Velislava Terziyska and Jozef Keckes and Josef Zechner and Christian Mitterer",

year = "2016",

language = "English",

note = "8th International Conference On Technological Advances Of Thin Films and Surface Coatings ; Conference date: 12-07-2016 Through 15-07-2016",

}

Souli, I, Terziyska, V , Keckes, J, Zechner, J & Mitterer, C 2016, 'Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers ', 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapur, 12/07/16 - 15/07/16.

Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers . / Souli, Imane; Terziyska, Velislava ; Keckes, Jozef et al.
2016. 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapur.

Publikation: Konferenzbeitrag › Vortrag › Forschung

Souli I, Terziyska V , Keckes J, Zechner J, Mitterer C. Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers . 2016. 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapur.

Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers

Konferenz

Aktivitäten

8th International Conference On Technological Advances Of Thin Films and Surface Coatings

Dieses zitieren