Determination of cyclic mechanical properties of thin copper layers for PCB applications

Klaus Fellner; Peter F. Fuchs; Thomas Antretter; Gerald Pinter; Ronald Schöngrundner

Determination of cyclic mechanical properties of thin copper layers for PCB applications

Titel in Übersetzung: Determination of cyclic mechanical properties of thin copper layers for PCB applications

Klaus Fellner
, Peter F. Fuchs
, Thomas Antretter
, Gerald Pinter
, Ronald Schöngrundner

Lehrstuhl für Mechanik (400)

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

8 Zitate (Scopus)

Titel in Übersetzung	Determination of cyclic mechanical properties of thin copper layers for PCB applications
Originalsprache	Englisch
Titel	Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Herausgeber (Verlag)	G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger
Seiten	1-8
ISBN (Print)	978-1-4799-4791-1
Publikationsstatus	Veröffentlicht - 2014

Dieses zitieren

Fellner, K., Fuchs, P. F., Antretter, T., Pinter, G., & Schöngrundner, R. (2014). Determination of cyclic mechanical properties of thin copper layers for PCB applications. in Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (S. 1-8). G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger.

Fellner, Klaus ; Fuchs, Peter F. ; Antretter, Thomas et al. / Determination of cyclic mechanical properties of thin copper layers for PCB applications. Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger, 2014. S. 1-8

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Fellner, K, Fuchs, PF, Antretter, T , Pinter, G & Schöngrundner, R 2014, Determination of cyclic mechanical properties of thin copper layers for PCB applications. in Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger, S. 1-8.

Determination of cyclic mechanical properties of thin copper layers for PCB applications. / Fellner, Klaus; Fuchs, Peter F.; Antretter, Thomas et al.
Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger, 2014. S. 1-8.

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

TY - GEN

T1 - Determination of cyclic mechanical properties of thin copper layers for PCB applications

AU - Fellner, Klaus

AU - Fuchs, Peter F.

AU - Antretter, Thomas

AU - Pinter, Gerald

AU - Schöngrundner, Ronald

PY - 2014

Y1 - 2014

M3 - Conference contribution

SN - 978-1-4799-4791-1

SP - 1

EP - 8

BT - Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

PB - G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger

ER -

Fellner K, Fuchs PF, Antretter T , Pinter G, Schöngrundner R. Determination of cyclic mechanical properties of thin copper layers for PCB applications. in Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger. 2014. S. 1-8