Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers

Imane Souli; Velislava Terziyska; Jozef Keckes; Werner Robl; Johannes Zechner; Christian Mitterer

doi:10.1116/1.4975805

Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers

Imane Souli, Velislava Terziyska, Jozef Keckes, Werner Robl, Johannes Zechner, Christian Mitterer

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Begutachtung

5 Zitate (Scopus)

Originalsprache	Englisch
Aufsatznummer	022201
Seitenumfang	11
Fachzeitschrift	Journal of vacuum science & technology / B (JVST)
Jahrgang	35.2017
Ausgabenummer	2
DOIs	https://doi.org/10.1116/1.4975805
Publikationsstatus	Veröffentlicht - 9 Feb. 2017

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10.1116/1.4975805

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Effect of growth conditions on interface stability and thermophysical properties of sputtered Cu films on Si with and without WTi barrier layers. / Souli, Imane; Terziyska, Velislava ; Keckes, Jozef et al.
in: Journal of vacuum science & technology / B (JVST), Jahrgang 35.2017, Nr. 2, 022201, 09.02.2017.

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Begutachtung

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AU - Souli, Imane

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AU - Robl, Werner

AU - Zechner, Johannes

AU - Mitterer, Christian

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