Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

Mario Gschwandl; Markus Frewein; Peter Filipp Fuchs; Thomas Antretter; Gerald Pinter; Philipp Novak

doi:10.1109/EMAP.2018.8660763

Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

Mario Gschwandl, Markus Frewein, Peter Filipp Fuchs, Thomas Antretter, Gerald Pinter, Philipp Novak

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Originalsprache	Englisch
Titel	EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging
Herausgeber (Verlag)	Institute of Electrical and Electronics Engineers
ISBN (elektronisch)	9781538656426
ISBN (Print)	9781538656426
DOIs	https://doi.org/10.1109/EMAP.2018.8660763
Publikationsstatus	Veröffentlicht - 5 März 2019
Veranstaltung	20th International Conference on Electronic Materials and Packaging, EMAP 2018 - Clear Water Bay, Hong Kong Dauer: 17 Dez. 2018 → 20 Dez. 2018

Publikationsreihe

Name	EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging

Konferenz

Konferenz	20th International Conference on Electronic Materials and Packaging, EMAP 2018
Land/Gebiet	Hong Kong
Ort	Clear Water Bay
Zeitraum	17/12/18 → 20/12/18

Zugriff auf Dokument

10.1109/EMAP.2018.8660763

Andere Dateien und Links

Dieses zitieren

Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G., & Novak, P. (2019). Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers. in EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging Artikel 8660763 (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EMAP.2018.8660763

Gschwandl, Mario ; Frewein, Markus ; Fuchs, Peter Filipp et al. / Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers. EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 2019. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

@inproceedings{9589af8d912a4773824d5fe699b6a090,

title = "Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers",

author = "Mario Gschwandl and Markus Frewein and Fuchs, {Peter Filipp} and Thomas Antretter and Gerald Pinter and Philipp Novak",

year = "2019",

month = mar,

day = "5",

doi = "10.1109/EMAP.2018.8660763",

language = "English",

isbn = "9781538656426",

series = "EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging",

publisher = "Institute of Electrical and Electronics Engineers",

booktitle = "EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging",

address = "United States",

note = "20th International Conference on Electronic Materials and Packaging, EMAP 2018 ; Conference date: 17-12-2018 Through 20-12-2018",

}

Gschwandl, M, Frewein, M, Fuchs, PF, Antretter, T , Pinter, G & Novak, P 2019, Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers. in EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging., 8660763, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, Institute of Electrical and Electronics Engineers, 20th International Conference on Electronic Materials and Packaging, EMAP 2018, Clear Water Bay, Hong Kong, 17/12/18. https://doi.org/10.1109/EMAP.2018.8660763

Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers. / Gschwandl, Mario; Frewein, Markus; Fuchs, Peter Filipp et al.
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 2019. 8660763 (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

TY - GEN

T1 - Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

AU - Gschwandl, Mario

AU - Frewein, Markus

AU - Fuchs, Peter Filipp

AU - Antretter, Thomas

AU - Pinter, Gerald

AU - Novak, Philipp

PY - 2019/3/5

Y1 - 2019/3/5

UR - http://www.scopus.com/inward/record.url?scp=85063882073&partnerID=8YFLogxK

UR - https://pure.unileoben.ac.at/portal/en/publications/evaluation-of-digital-image-correlation-techniques-for-the-determination-of-coefficients-of-thermal-expansion-for-thin-reinforced-polymers(9589af8d-912a-4773-824d-5fe699b6a090).html

U2 - 10.1109/EMAP.2018.8660763

DO - 10.1109/EMAP.2018.8660763

M3 - Conference contribution

AN - SCOPUS:85063882073

SN - 9781538656426

T3 - EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging

BT - EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging

PB - Institute of Electrical and Electronics Engineers

T2 - 20th International Conference on Electronic Materials and Packaging, EMAP 2018

Y2 - 17 December 2018 through 20 December 2018

ER -

Gschwandl M, Frewein M, Fuchs PF, Antretter T , Pinter G, Novak P. Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers. in EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers. 2019. 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging). doi: 10.1109/EMAP.2018.8660763