Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

Darjan Kozic; Ruth Treml; Ronald Schöngrundner; Roland Brunner; Daniel Kiener; Thomas Antretter; Hans-Peter Gänser

doi:10.1109/EuroSimE.2014.6813785

Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

Darjan Kozic, Ruth Treml, Ronald Schöngrundner, Roland Brunner, Daniel Kiener, Thomas Antretter, Hans-Peter Gänser

Materials Center Leoben Forschungs GmbH

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

4 Zitate (Scopus)

Originalsprache	Englisch
Titel	Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
Redakteure/-innen	G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger
Herausgeber (Verlag)	Institute of Electrical and Electronics Engineers
ISBN (Print)	978-1-4799-4791-1
DOIs	https://doi.org/10.1109/EuroSimE.2014.6813785
Publikationsstatus	Veröffentlicht - 2014
Veranstaltung	15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Gent, Belgien Dauer: 7 Apr. 2014 → 9 Apr. 2014

Konferenz

Konferenz	15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Kurztitel	EuroSimE 2014
Land/Gebiet	Belgien
Ort	Gent
Zeitraum	7/04/14 → 9/04/14

Zugriff auf Dokument

10.1109/EuroSimE.2014.6813785

Andere Dateien und Links

Link to publication in Scopus

Dieses zitieren

Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T., & Gänser, H.-P. (2014). Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method. in G. Q. Zhang, W. D. Van Driel, P. Rodgers, C. Bailey, & O. de Saint Leger (Hrsg.), Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 Artikel 6813785 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE.2014.6813785

Kozic, Darjan ; Treml, Ruth ; Schöngrundner, Ronald et al. / Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method. Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Hrsg. / G.Q. Zhang ; W.D. Van Driel ; P. Rodgers ; C. Bailey ; O. de Saint Leger. Institute of Electrical and Electronics Engineers, 2014.

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title = "Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method",

author = "Darjan Kozic and Ruth Treml and Ronald Sch{\"o}ngrundner and Roland Brunner and Daniel Kiener and Thomas Antretter and Hans-Peter G{\"a}nser",

year = "2014",

doi = "10.1109/EuroSimE.2014.6813785",

language = "English",

isbn = "978-1-4799-4791-1",

editor = "G.Q. Zhang and {Van Driel}, W.D. and P. Rodgers and C. Bailey and {de Saint Leger}, O.",

booktitle = "Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014",

publisher = "Institute of Electrical and Electronics Engineers",

address = "United States",

note = "15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 ; Conference date: 07-04-2014 Through 09-04-2014",

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Kozic, D, Treml, R, Schöngrundner, R, Brunner, R , Kiener, D , Antretter, T & Gänser, H-P 2014, Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method. in GQ Zhang, WD Van Driel, P Rodgers, C Bailey & O de Saint Leger (Hrsg.), Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014., 6813785, Institute of Electrical and Electronics Engineers, 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Gent, Belgien, 7/04/14. https://doi.org/10.1109/EuroSimE.2014.6813785

Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method. / Kozic, Darjan; Treml, Ruth; Schöngrundner, Ronald et al.
Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Hrsg. / G.Q. Zhang; W.D. Van Driel; P. Rodgers; C. Bailey; O. de Saint Leger. Institute of Electrical and Electronics Engineers, 2014. 6813785.

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

TY - GEN

T1 - Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

AU - Kozic, Darjan

AU - Treml, Ruth

AU - Schöngrundner, Ronald

AU - Brunner, Roland

AU - Kiener, Daniel

AU - Antretter, Thomas

AU - Gänser, Hans-Peter

PY - 2014

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U2 - 10.1109/EuroSimE.2014.6813785

DO - 10.1109/EuroSimE.2014.6813785

M3 - Conference contribution

AN - SCOPUS:84901420857

SN - 978-1-4799-4791-1

BT - Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014

A2 - Zhang, G.Q.

A2 - Van Driel, W.D.

A2 - Rodgers, P.

A2 - Bailey, C.

A2 - de Saint Leger, O.

PB - Institute of Electrical and Electronics Engineers

T2 - 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014

Y2 - 7 April 2014 through 9 April 2014

ER -

Kozic D, Treml R, Schöngrundner R, Brunner R , Kiener D , Antretter T et al. Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method. in Zhang GQ, Van Driel WD, Rodgers P, Bailey C, de Saint Leger O, Hrsg., Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Institute of Electrical and Electronics Engineers. 2014. 6813785 doi: 10.1109/EuroSimE.2014.6813785