Improved nanoindentation methods for polymer based multilayer film cross-sections

P. Christoefl; J. E. Jakes; J. Geier; G. Pinter; G. Oreski; D. Stone; C. Teichert

doi:10.1109/EuroSimE56861.2023.10100815

Improved nanoindentation methods for polymer based multilayer film cross-sections

P. Christoefl, J. E. Jakes, J. Geier, G. Pinter, G. Oreski, D. Stone, C. Teichert

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Originalsprache	Englisch
Titel	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Herausgeber (Verlag)	Institute of Electrical and Electronics Engineers
ISBN (elektronisch)	9798350345971
DOIs	https://doi.org/10.1109/EuroSimE56861.2023.10100815
Publikationsstatus	Veröffentlicht - 2023
Veranstaltung	24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 - Graz, Österreich Dauer: 16 Apr. 2023 → 19 Apr. 2023

Publikationsreihe

Name	2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Konferenz

Konferenz	24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Land/Gebiet	Österreich
Ort	Graz
Zeitraum	16/04/23 → 19/04/23

Bibliographische Notiz

Funding Information:
Acknowledgments The research work was performed within the COMETproject “Micromechanical properties of layered polymers " (project-no.: 3S4) at the Polymer Competence Center Leoben GmbH (PCCL, Austria) within the framework of the COMET-program of the Federal Ministry for Transport, Innovation and Technology and the Federal Ministry for Digital and Economic Affairs. The PCCL is funded by the Austrian Government and the State Governments of Styria, Lower Austria and Upper Austria.

Publisher Copyright:
© 2023 IEEE.

Zugriff auf Dokument

10.1109/EuroSimE56861.2023.10100815

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Dieses zitieren

Christoefl, P., Jakes, J. E., Geier, J., Pinter, G., Oreski, G., Stone, D., & Teichert, C. (2023). Improved nanoindentation methods for polymer based multilayer film cross-sections. in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE56861.2023.10100815

Christoefl, P. ; Jakes, J. E. ; Geier, J. et al. / Improved nanoindentation methods for polymer based multilayer film cross-sections. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

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Christoefl, P, Jakes, JE, Geier, J, Pinter, G , Oreski, G, Stone, D & Teichert, C 2023, Improved nanoindentation methods for polymer based multilayer film cross-sections. in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Institute of Electrical and Electronics Engineers, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz, Österreich, 16/04/23. https://doi.org/10.1109/EuroSimE56861.2023.10100815

Improved nanoindentation methods for polymer based multilayer film cross-sections. / Christoefl, P.; Jakes, J. E.; Geier, J. et al.
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

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T1 - Improved nanoindentation methods for polymer based multilayer film cross-sections

AU - Christoefl, P.

AU - Jakes, J. E.

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AU - Pinter, G.

AU - Oreski, G.

AU - Stone, D.

AU - Teichert, C.

PY - 2023

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DO - 10.1109/EuroSimE56861.2023.10100815

M3 - Conference contribution

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T3 - 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

BT - 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

PB - Institute of Electrical and Electronics Engineers

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Christoefl P, Jakes JE, Geier J, Pinter G , Oreski G, Stone D et al. Improved nanoindentation methods for polymer based multilayer film cross-sections. in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers. 2023. (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023). doi: 10.1109/EuroSimE56861.2023.10100815