In-situ microscopy methods for imaging high-temperature microstructural processes – Exploring the differences and gaining new potentials

Lea Lumper, Gerald J.K. Schaffar, Michael Sommerauer, Verena Maier-Kiener

Publikation: Beitrag in FachzeitschriftArtikelForschungBegutachtung

Abstract

In-situ high-temperature microscopy techniques provide crucial insights into materials under non-ambient conditions. This study compares confocal laser scanning and scanning electron microscopy for material characterization at elevated temperatures. Thereby, investigations are made regarding their imaging capabilities, limitations, and the general information obtained. Two alloys, Cu-20 m.% Sn and W-10 m.% Re, are used as case studies to demonstrate the applicability of the techniques. By studying phenomena such as grain growth, phase transformations, and thermal crack, we gain important insights to understand mechanical properties and thermal behavior better. This comprehensive analysis aids in selecting the most appropriate microscopy technique based on the research objectives. Overall, this study helps advance high-temperature materials science and promotes progress in several areas requiring accurate materials characterization under high thermal conditions.

OriginalspracheEnglisch
Aufsatznummer145738
Seitenumfang9
FachzeitschriftMaterials science and engineering: A, Structural materials: properties, microstructure and processing
Jahrgang887.2023
Ausgabenummer6 November
Frühes Online-Datum29 Sept. 2023
DOIs
PublikationsstatusVeröffentlicht - 6 Nov. 2023

Bibliographische Notiz

Funding Information:
The authors would like to thank Dr. Johann Kappacher (Department of Materials Science, Montanuniversität Leoben, Austria; now with ams-OSRAM AG, Premstätten, Austria) for encouraging the construction of the HT-SEM setup. Additionally, the authors would also like to express their sincere gratitude to Prof. Dr. Daniel Kiener for his valuable discussions and insights that greatly contributed to the quality of this work.

Publisher Copyright:
© 2023 The Authors

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