In-situ TEM investigation of toughening in Silicon at small scales

Inas Issa, Christoph Gammer, Stefan Kolitsch, Anton Hohenwarter, Peter J. Imrich, Reinhard Pippan, Daniel Kiener

Publikation: Beitrag in FachzeitschriftArtikelForschungBegutachtung

75 Downloads (Pure)
OriginalspracheEnglisch
Seiten (von - bis)29-37
Seitenumfang9
FachzeitschriftMaterials today
Jahrgang48
Ausgabenummer48
Frühes Online-Datum3 Juli 2021
DOIs
PublikationsstatusVeröffentlicht - Sept. 2021

Bibliographische Notiz

Funding Information:
I.I. and D.K. acknowledge funding by the European Research Council under Grant number 771146 (TOUGHIT). Authors would like to acknowledge Gabriele Felber and Herwig Felber for preparing wedge shaped samples, and Manuel Pfeifenberger and Alexander Jelinek for micro lamellas cut on the top surface of the wedge-shaped samples by a femtosecond laser. The authors gratefully acknowledge the financial support under the scope of the COMET program within the K2 Center “Integrated Computational Material, Process and Product Engineering, IC-MPPE” (Strategic Project P1.3).

Publisher Copyright:
© 2021 The Author(s)

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