Influence of cooling rate and annealing on the DSC Tg of an epoxy resin

Qi Tao; Gerald Pinter; Thomas Krivec

doi:10.1016/j.microrel.2017.07.088

Influence of cooling rate and annealing on the DSC Tg of an epoxy resin

Qi Tao, Gerald Pinter, Thomas Krivec

AT&S - Austria Technologie & Systemtechnik Aktiengesselschaft Leoben

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Begutachtung

2 Zitate (Scopus)

Originalsprache	Englisch
Seiten (von - bis)	396-400
Seitenumfang	5
Fachzeitschrift	Microelectronics Reliability
Jahrgang	78.2017
Ausgabenummer	November
DOIs	https://doi.org/10.1016/j.microrel.2017.07.088
Publikationsstatus	Elektronische Veröffentlichung vor Drucklegung. - 27 Juli 2017

Zugriff auf Dokument

10.1016/j.microrel.2017.07.088

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Dieses zitieren

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title = "Influence of cooling rate and annealing on the DSC Tg of an epoxy resin",

keywords = "Annealing, Cooling rate, Curing pressure, Endothermic peak, Epoxy resin, Glass transition",

author = "Qi Tao and Gerald Pinter and Thomas Krivec",

year = "2017",

month = jul,

day = "27",

doi = "10.1016/j.microrel.2017.07.088",

language = "English",

volume = "78.2017",

pages = "396--400",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier",

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TY - JOUR

T1 - Influence of cooling rate and annealing on the DSC Tg of an epoxy resin

AU - Tao, Qi

AU - Pinter, Gerald

AU - Krivec, Thomas

PY - 2017/7/27

Y1 - 2017/7/27

KW - Annealing

KW - Cooling rate

KW - Curing pressure

KW - Endothermic peak

KW - Epoxy resin

KW - Glass transition

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U2 - 10.1016/j.microrel.2017.07.088

DO - 10.1016/j.microrel.2017.07.088

M3 - Article

AN - SCOPUS:85026224896

SN - 0026-2714

VL - 78.2017

SP - 396

EP - 400

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - November

ER -