Influence of extreme thermal cycling on metal-polymer interfaces

Barbara Putz; Bernhard Völker; Christopher Semprimoschnig; Megan J. Cordill

doi:10.1016/j.mee.2016.10.012

Influence of extreme thermal cycling on metal-polymer interfaces

Barbara Putz, Bernhard Völker, Christopher Semprimoschnig, Megan J. Cordill

Lehrstuhl für Materialphysik (430)

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Begutachtung

10 Zitate (Scopus)

Originalsprache	Englisch
Seiten (von - bis)	17-22
Seitenumfang	6
Fachzeitschrift	Microelectronic engineering
Jahrgang	167.2017
Ausgabenummer	5 January
Frühes Online-Datum	18 Okt. 2016
DOIs	https://doi.org/10.1016/j.mee.2016.10.012
Publikationsstatus	Veröffentlicht - 5 Jan. 2017

Zugriff auf Dokument

10.1016/j.mee.2016.10.012

Andere Dateien und Links

Link to publication in Scopus

Dieses zitieren

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title = "Influence of extreme thermal cycling on metal-polymer interfaces",

keywords = "Adhesion, Buckling, Polymer, Thermal cycling, Thin film",

author = "Barbara Putz and Bernhard V{\"o}lker and Christopher Semprimoschnig and Cordill, {Megan J.}",

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AU - Putz, Barbara

AU - Völker, Bernhard

AU - Semprimoschnig, Christopher

AU - Cordill, Megan J.

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Y1 - 2017/1/5

KW - Adhesion

KW - Buckling

KW - Polymer

KW - Thermal cycling

KW - Thin film

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JF - Microelectronic engineering

IS - 5 January

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