Influence of Finite Mobilities of Triple Junctions on the Grain Morphology and Kinetics of Grain Growth

Ernst Gamsjäger, Boris Gschöpf, Jiri Svoboda

Publikation: Beitrag in FachzeitschriftArtikelForschungBegutachtung

Abstract

Grain boundary networks composed of equal microstructural elements were investigated in a recent paper. In this work a more complicated artificial grain topology consisting of one four-sided, two six-sided and one eight-sided grain is designed to further investigate the influence of grain boundary and triple junction mobilities on the kinetics of the system in more detail. Depending on the value of the equal mobility of all triple junctions, the initially square-shaped four-sided grain changes its shape to become more or less rectangular. This indicates that the grain morphology is influenced by the value of the mobility of the triple junctions. It is also demonstrated that a grain arrangement with low mobility triple junctions controlling the kinetics of grain growth enhances growth of the large eight-sided grains. In addition, grain growth is investigated for different values of mobilities of triple junctions and grain boundaries. A strong elongation of several grains is predicted by the modeling results for reduced mobilities of the microstructural grain boundary elements. The two-dimensional modeling results are compared to micrographs of a heat-treated titanium niobium microalloyed steel. This feature, namely the evolution of elongated grains, is observed in the micrograph due to the pinning effect of (Ti, Nb)C precipitates at elevated soaking temperatures of around 1100 °C. Furthermore, the experiments show that a broader distribution of the grain sizes occur at 1100 °C compared to soaking temperatures, where pinning due to precipitates plays a less prominent role. A widening of the distribution of the grain sizes for small triple junction mobilities is also predicted by the unit cell model.

OriginalspracheEnglisch
Aufsatznummer185
Seitenumfang18
FachzeitschriftMetals : open access journal
Jahrgang10.2020
DOIs
PublikationsstatusVeröffentlicht - 27 Jan. 2020

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