Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates

Aleksandra Samusjew; Alice  Lassnig; Megan J. Cordill; Krzysztof Krawczyk; Thomas Grießer

doi:10.1002/admt.201700250

Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates

Aleksandra Samusjew, Alice Lassnig, Megan J. Cordill, Krzysztof Krawczyk, Thomas Grießer

Erich-Schmid-Institut für Materialwissenschaft der Österreichischen Akademie der Wissenschaften

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Begutachtung

8 Zitate (Scopus)

Originalsprache	Englisch
Aufsatznummer	1700250
Fachzeitschrift	Advanced Materials Technologies
Jahrgang	3
Ausgabenummer	4
DOIs	https://doi.org/10.1002/admt.201700250
Publikationsstatus	Veröffentlicht - 1 Apr. 2018

Zugriff auf Dokument

10.1002/admt.201700250

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Link to publication in Scopus

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title = "Inkjet Printed Wiring Boards with Vertical Interconnect Access on Flexible, Fully Compostable Cellulose Substrates",

keywords = "biodegradable electronics, cellulose, inkjet printing, printed electronics, printed wiring boards, vertical interconnect access",

author = "Aleksandra Samusjew and Alice Lassnig and Cordill, {Megan J.} and Krzysztof Krawczyk and Thomas Grie{\ss}er",

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AU - Krawczyk, Krzysztof

AU - Grießer, Thomas

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