Integrated experimental and computational approach for residual stress investigation near through-silicon vias

Marco Deluca, R. Hammer, Jozef Keckes, J. Kraft, F. Schrank, Juraj Todt, O. Robach, J. S. Micha, Stefan Defregger

Publikation: Beitrag in FachzeitschriftArtikelForschungBegutachtung

5 Zitate (Scopus)

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