Integrated experimental and computational approach for residual stress investigation near through-silicon vias

Marco Deluca; R. Hammer; Jozef Keckes; J. Kraft; F. Schrank; Juraj Todt; O. Robach; J. S. Micha; Stefan Defregger

doi:10.1063/1.4967927

Integrated experimental and computational approach for residual stress investigation near through-silicon vias

Marco Deluca
, R. Hammer
, Jozef Keckes
, J. Kraft
, F. Schrank
, Juraj Todt
, O. Robach
, J. S. Micha
, Stefan Defregger

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Begutachtung

5 Zitate (Scopus)

Originalsprache	undefiniert/unbekannt
Fachzeitschrift	Journal of applied physics
Jahrgang	120
Ausgabenummer	19
DOIs	https://doi.org/10.1063/1.4967927
Publikationsstatus	Veröffentlicht - 2016

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10.1063/1.4967927

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84999036929&doi=10.1063%2f1.4967927&partnerID=40&md5=7f5a0e912e8ab239295c034aa832f098

Dieses zitieren

@article{a3244f40f7c14d2e90ed881c3b8b0a6c,

title = "Integrated experimental and computational approach for residual stress investigation near through-silicon vias",

author = "Marco Deluca and R. Hammer and Jozef Keckes and J. Kraft and F. Schrank and Juraj Todt and O. Robach and Micha, \{J. S.\} and Stefan Defregger",

year = "2016",

doi = "10.1063/1.4967927",

language = "Undefined/Unknown",

volume = "120",

journal = "Journal of applied physics",

issn = "0021-8979",

publisher = "American Institute of Physics",

number = "19",

}

TY - JOUR

T1 - Integrated experimental and computational approach for residual stress investigation near through-silicon vias

AU - Deluca, Marco

AU - Hammer, R.

AU - Keckes, Jozef

AU - Kraft, J.

AU - Schrank, F.

AU - Todt, Juraj

AU - Robach, O.

AU - Micha, J. S.

AU - Defregger, Stefan

PY - 2016

Y1 - 2016

U2 - 10.1063/1.4967927

DO - 10.1063/1.4967927

M3 - Article

SN - 0021-8979

VL - 120

JO - Journal of applied physics

JF - Journal of applied physics

IS - 19

ER -