Knowledge Incorporation for Machine Learning in Condition Monitoring: A Survey

Elias Jan Hagendorfer

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

OriginalspracheEnglisch
TitelProceedings - 2021 International Symposium on Electrical, Electronics and Information Engineering, ISEEIE 2021
Herausgeber (Verlag)Association for Computing Machinery (ACM)
Seiten230-240
Seitenumfang11
ISBN (elektronisch)9781450389839
DOIs
PublikationsstatusVeröffentlicht - 19 Feb. 2021
Veranstaltung2021 International Symposium on Electrical, Electronics and Information Engineering, ISEEIE 2021 - Virtual, Online, Südkorea
Dauer: 19 Feb. 202121 Feb. 2021

Publikationsreihe

NameACM International Conference Proceeding Series

Konferenz

Konferenz2021 International Symposium on Electrical, Electronics and Information Engineering, ISEEIE 2021
Land/GebietSüdkorea
OrtVirtual, Online
Zeitraum19/02/2121/02/21

Bibliographische Notiz

Funding Information:
The author gratefully acknowledges the financial support under the scope of the COMET program within the K2 Center Integrated Computational Material, Process and Product Engineering (IC-MPPE) (Project No 859480). This program is supported by the Austrian Federal Ministries for Transport, Innovation and Technology (BMVIT) and for Digital and Economic Affairs (BMDW), represented by the Austrian research funding association (FFG), and the federal states of Styria, Upper Austria and Tyrol.

Publisher Copyright:
© 2021 ACM.

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