Abstract
Piezoelectric micromechanical systems (piezoMEMS) are often subjected to harsh mechanical and electrical loads during operation. This study evaluates the effects of the electrical history of a lead zirconate titanate (PZT) layer on the electro-mechanical response and structural limits of multilayer stacks. Electro-mechanical characterization was performed under biaxial bending employing the Ball-on-three Balls (B3B) test on virgin, poled, and DC biased (80 kV/cm) samples. No significant effect on the characteristic strength or Weibull modulus of the stack was observed. However, the crack initiation stress was highest for the virgin samples (σ 0 ∼ 485 ± 30 MPa); this decreased for both poled samples (σ 0 ∼ 410 ± 30 MPa), and samples measured under 80 kV/cm (σ 0 ∼ 433 ± 30 MPa). in situ ε r and loss tangent measurements suggested electromechanical loading conditions can destabilize the domain structure. Overall, the electrical history and electromechanical loading conditions can reduce the PZT film's fracture resistance.
| Titel in Übersetzung | nich verfügbar |
|---|---|
| Originalsprache | Englisch |
| Seiten (von - bis) | 2465-2471 |
| Seitenumfang | 7 |
| Fachzeitschrift | Journal of the European Ceramic Society |
| Jahrgang | 41 |
| Ausgabenummer | 4 |
| DOIs | |
| Publikationsstatus | Veröffentlicht - Apr. 2021 |
Bibliographische Notiz
Funding Information:This manuscript is based on work supported by the National Science Foundation, as part of the Center for Dielectrics and Piezoelectrics under Grant Nos. IIP-1841453, and IIP-1841466. The authors would also like to acknowledge Trevor Clark at the Materials Characterization Lab at Penn State for taking the FIB images.
Funding Information:
This manuscript is based on work supported by the National Science Foundation , as part of the Center for Dielectrics and Piezoelectrics under Grant Nos. IIP-1841453 , and IIP-1841466 . The authors would also like to acknowledge Trevor Clark at the Materials Characterization Lab at Penn State for taking the FIB images.
Publisher Copyright:
© 2020 Elsevier Ltd
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