Method development for the cyclic characterization of thin copper layers for PCB applications

Titel in Übersetzung: Method development for the cyclic characterization of thin copper layers for PCB applications

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Begutachtung

7 Zitate (Scopus)

Titel in Übersetzung	Method development for the cyclic characterization of thin copper layers for PCB applications
Originalsprache	Englisch
Seiten (von - bis)	53-60
Fachzeitschrift	Circuit World
Jahrgang	40
DOIs	https://doi.org/10.1108/CW-09-2013-0032
Publikationsstatus	Veröffentlicht - 2014

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@article{d9f1d3ad53014b62886eadb9cd102324,

title = "Method development for the cyclic characterization of thin copper layers for PCB applications",

author = "Klaus Fellner and Fuchs, \{Peter Filipp\} and Gerald Pinter and Thomas Antretter and Thomas Krivec",

year = "2014",

doi = "10.1108/CW-09-2013-0032",

language = "English",

volume = "40",

pages = "53--60",

journal = "Circuit World",

issn = "0305-6120",

publisher = "Emerald Group Publishing Ltd.",

}

TY - JOUR

T1 - Method development for the cyclic characterization of thin copper layers for PCB applications

AU - Fellner, Klaus

AU - Fuchs, Peter Filipp

AU - Pinter, Gerald

AU - Antretter, Thomas

AU - Krivec, Thomas

PY - 2014

Y1 - 2014

U2 - 10.1108/CW-09-2013-0032

DO - 10.1108/CW-09-2013-0032

M3 - Article

SN - 0305-6120

VL - 40

SP - 53

EP - 60

JO - Circuit World

JF - Circuit World

ER -