Microstructural and mechanical investigations of thermo-mechanically loaded Cu films using a thermal laser cycling device

Stephan Bigl, Stefan Wurster, Megan J Cordill, Daniel Kiener

Publikation: Konferenzbeitrag › Poster › Forschung

Originalsprache	Englisch
Publikationsstatus	Veröffentlicht - 2016
Veranstaltung	Gordon Research Conference on Thin Film & Small Scale Mechanical Behavior, GRC 2016 - Lewiston, USA / Vereinigte Staaten Dauer: 24 Juli 2016 → 29 Juli 2016

Konferenz	Gordon Research Conference on Thin Film & Small Scale Mechanical Behavior, GRC 2016
Land/Gebiet	USA / Vereinigte Staaten
Ort	Lewiston
Zeitraum	24/07/16 → 29/07/16

Dieses zitieren

@conference{4259fd71d92c47858ea2a193f2dd490a,

title = "Microstructural and mechanical investigations of thermo-mechanically loaded Cu films using a thermal laser cycling device",

author = "Stephan Bigl and Stefan Wurster and Cordill, {Megan J} and Daniel Kiener",

year = "2016",

language = "English",

note = "Gordon Research Conference on Thin Film & Small Scale Mechanical Behavior, GRC 2016 ; Conference date: 24-07-2016 Through 29-07-2016",

}

Microstructural and mechanical investigations of thermo-mechanically loaded Cu films using a thermal laser cycling device. / Bigl, Stephan; Wurster, Stefan; Cordill, Megan J et al.
2016. Postersitzung präsentiert bei Gordon Research Conference on Thin Film & Small Scale Mechanical Behavior, GRC 2016, Lewiston, USA / Vereinigte Staaten.

Publikation: Konferenzbeitrag › Poster › Forschung

TY - CONF

T1 - Microstructural and mechanical investigations of thermo-mechanically loaded Cu films using a thermal laser cycling device

AU - Bigl, Stephan

AU - Wurster, Stefan

AU - Cordill, Megan J

AU - Kiener, Daniel

PY - 2016

Y1 - 2016

M3 - Poster

T2 - Gordon Research Conference on Thin Film & Small Scale Mechanical Behavior, GRC 2016

Y2 - 24 July 2016 through 29 July 2016

ER -