Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices

Alice Lassnig; Velislava L. Terziyska; Jakub Zalesak; Tanja Jörg; Daniel M. Toebbens; Thomas Griesser; Christian Mitterer; Reinhard Pippan; Megan J. Cordill

doi:10.1021/acsanm.0c02182

Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices

Alice Lassnig, Velislava L. Terziyska, Jakub Zalesak, Tanja Jörg, Daniel M. Toebbens, Thomas Griesser, Christian Mitterer, Reinhard Pippan, Megan J. Cordill

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Begutachtung

1 Zitat (Scopus)

Originalsprache	Englisch
Seiten (von - bis)	61-70
Seitenumfang	10
Fachzeitschrift	ACS Applied Nano Materials
Jahrgang	4.2021
Ausgabenummer	1
DOIs	https://doi.org/10.1021/acsanm.0c02182
Publikationsstatus	Veröffentlicht - 28 Dez. 2020

Bibliographische Notiz

Funding Information:
A.L. is funded by the Austrian Science Fund (FWF) within the Hertha Firnberg Program (T891-N36). Part of this work was carried out with the support of CEITEC Nano Research Infrastructure supported by MEYS CR (LM2018110). The authors would also like to acknowledge Helmholtz Zentrum Berlin for the allocation of synchrotron radiation beam time and thankfully acknowledge the financial support of Helmholtz Zentrum Berlin (project 17205962-ST-1.1-P).

Publisher Copyright:
© 2020 American Chemical Society.

Zugriff auf Dokument

10.1021/acsanm.0c02182

Andere Dateien und Links

Verknüpfung zur Publikation in Scopus

Dieses zitieren

@article{cfb13d8e5c454299acc2ac1ffabbf3d5,

title = "Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices",

keywords = "brittle-ductile interface, film microstructure, nanosized Cu films, spontaneous buckles, thin film adhesion",

author = "Alice Lassnig and Terziyska, {Velislava L.} and Jakub Zalesak and Tanja J{\"o}rg and Toebbens, {Daniel M.} and Thomas Griesser and Christian Mitterer and Reinhard Pippan and Cordill, {Megan J.}",

note = "Publisher Copyright: {\textcopyright} 2020 American Chemical Society.",

year = "2020",

month = dec,

day = "28",

doi = "10.1021/acsanm.0c02182",

language = "English",

volume = "4.2021",

pages = "61--70",

journal = "ACS Applied Nano Materials",

issn = "2574-0970",

publisher = "American Chemical Society",

number = "1",

}

TY - JOUR

T1 - Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates

T2 - Implications for Microelectronic Devices

AU - Lassnig, Alice

AU - Terziyska, Velislava L.

AU - Zalesak, Jakub

AU - Jörg, Tanja

AU - Toebbens, Daniel M.

AU - Griesser, Thomas

AU - Mitterer, Christian

AU - Pippan, Reinhard

AU - Cordill, Megan J.

PY - 2020/12/28

Y1 - 2020/12/28

KW - brittle-ductile interface

KW - film microstructure

KW - nanosized Cu films

KW - spontaneous buckles

KW - thin film adhesion

UR - http://www.scopus.com/inward/record.url?scp=85099212374&partnerID=8YFLogxK

U2 - 10.1021/acsanm.0c02182

DO - 10.1021/acsanm.0c02182

M3 - Article

AN - SCOPUS:85099212374

SN - 2574-0970

VL - 4.2021

SP - 61

EP - 70

JO - ACS Applied Nano Materials

JF - ACS Applied Nano Materials

IS - 1

ER -