Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices

Alice Lassnig, Velislava L. Terziyska, Jakub Zalesak, Tanja Jörg, Daniel M. Toebbens, Thomas Griesser, Christian Mitterer, Reinhard Pippan, Megan J. Cordill

Publikation: Beitrag in FachzeitschriftArtikelForschungBegutachtung

1 Zitat (Scopus)
Seiten (von - bis)61-70
FachzeitschriftACS Applied Nano Materials
PublikationsstatusVeröffentlicht - 28 Dez. 2020

Bibliographische Notiz

Funding Information:
A.L. is funded by the Austrian Science Fund (FWF) within the Hertha Firnberg Program (T891-N36). Part of this work was carried out with the support of CEITEC Nano Research Infrastructure supported by MEYS CR (LM2018110). The authors would also like to acknowledge Helmholtz Zentrum Berlin for the allocation of synchrotron radiation beam time and thankfully acknowledge the financial support of Helmholtz Zentrum Berlin (project 17205962-ST-1.1-P).

Publisher Copyright:
© 2020 American Chemical Society.

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