Modeling Microstructure Sensitive Degradation of Electroplated Copper During Short Circuit Power Pulsing

Alexander Huber; Thomas Antretter; Manuel Petersmann

doi:10.1109/EuroSimE65125.2025.11006557

Modeling Microstructure Sensitive Degradation of Electroplated Copper During Short Circuit Power Pulsing

Alexander Huber
, Thomas Antretter
, Manuel Petersmann

Lehrstuhl für Mechanik (400)

Kompetenzzentrum Automobil- und Industrieelektronik GmbH

Publikation: Konferenzbeitrag › Paper › Begutachtung

Originalsprache	Englisch
DOIs	https://doi.org/10.1109/EuroSimE65125.2025.11006557
Publikationsstatus	Veröffentlicht - 2025
Veranstaltung	EuroSimE 2025 : 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Utrecht, Niederlande Dauer: 6 Apr. 2025 → 9 Apr. 2025

Konferenz

Konferenz	EuroSimE 2025 : 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Land/Gebiet	Niederlande
Ort	Utrecht
Zeitraum	6/04/25 → 9/04/25

Zugriff auf Dokument

10.1109/EuroSimE65125.2025.11006557

EuroSimE 2025 : 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Huber, A. (Gastredner/-in)
2025
Aktivität: Teilnahme an oder Organisation einer Veranstaltung › Konferenzteilnahme

Dieses zitieren

Huber, A., Antretter, T., & Petersmann, M. (2025). Modeling Microstructure Sensitive Degradation of Electroplated Copper During Short Circuit Power Pulsing. Beitrag in EuroSimE 2025 : 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Utrecht, Niederlande. https://doi.org/10.1109/EuroSimE65125.2025.11006557

@conference{7d3f12dfacbb4f01861c38ba6567ca6b,

title = "Modeling Microstructure Sensitive Degradation of Electroplated Copper During Short Circuit Power Pulsing",

author = "Alexander Huber and Thomas Antretter and Manuel Petersmann",

year = "2025",

doi = "10.1109/EuroSimE65125.2025.11006557",

language = "English",

note = "EuroSimE 2025 : 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 06-04-2025 Through 09-04-2025",

}

Huber, A , Antretter, T & Petersmann, M 2025, 'Modeling Microstructure Sensitive Degradation of Electroplated Copper During Short Circuit Power Pulsing', Beitrag in EuroSimE 2025 : 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Utrecht, Niederlande, 6/04/25 - 9/04/25. https://doi.org/10.1109/EuroSimE65125.2025.11006557

Modeling Microstructure Sensitive Degradation of Electroplated Copper During Short Circuit Power Pulsing. / Huber, Alexander ; Antretter, Thomas; Petersmann, Manuel.
2025. Beitrag in EuroSimE 2025 : 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Utrecht, Niederlande.

Publikation: Konferenzbeitrag › Paper › Begutachtung

TY - CONF

T1 - Modeling Microstructure Sensitive Degradation of Electroplated Copper During Short Circuit Power Pulsing

AU - Huber, Alexander

AU - Antretter, Thomas

AU - Petersmann, Manuel

PY - 2025

Y1 - 2025

U2 - 10.1109/EuroSimE65125.2025.11006557

DO - 10.1109/EuroSimE65125.2025.11006557

M3 - Paper

T2 - EuroSimE 2025 : 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Y2 - 6 April 2025 through 9 April 2025

ER -

Huber A , Antretter T, Petersmann M. Modeling Microstructure Sensitive Degradation of Electroplated Copper During Short Circuit Power Pulsing. 2025. Beitrag in EuroSimE 2025 : 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Utrecht, Niederlande. doi: 10.1109/EuroSimE65125.2025.11006557

Modeling Microstructure Sensitive Degradation of Electroplated Copper During Short Circuit Power Pulsing

Konferenz

Zugriff auf Dokument

Aktivitäten

EuroSimE 2025 : 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Dieses zitieren