Nanoscale residual stress depth profiling by focused ion beam milling and eigenstrain analysis

Alexander M. Korsunsky; E. Salvati; A.G.J. Lunt; T. Sui; Z.M. Mughal; Rostislav Daniel; Jozef Keckes; E. Bemporad; M. Sebastiani

doi:10.1016/j.matdes.2018.02.044

Nanoscale residual stress depth profiling by focused ion beam milling and eigenstrain analysis

Alexander M. Korsunsky, E. Salvati, A.G.J. Lunt, T. Sui, Z.M. Mughal, Rostislav Daniel, Jozef Keckes, E. Bemporad, M. Sebastiani

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Begutachtung

39 Zitate (Scopus)

Originalsprache	Englisch
Seiten (von - bis)	55-64
Fachzeitschrift	Materials and Design
Jahrgang	145
DOIs	https://doi.org/10.1016/j.matdes.2018.02.044
Publikationsstatus	Veröffentlicht - 2018

Zugriff auf Dokument

10.1016/j.matdes.2018.02.044

Dieses zitieren

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title = "Nanoscale residual stress depth profiling by focused ion beam milling and eigenstrain analysis",

author = "Korsunsky, {Alexander M.} and E. Salvati and A.G.J. Lunt and T. Sui and Z.M. Mughal and Rostislav Daniel and Jozef Keckes and E. Bemporad and M. Sebastiani",

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AU - Korsunsky, Alexander M.

AU - Salvati, E.

AU - Lunt, A.G.J.

AU - Sui, T.

AU - Mughal, Z.M.

AU - Daniel, Rostislav

AU - Keckes, Jozef

AU - Bemporad, E.

AU - Sebastiani, M.

PY - 2018

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DO - 10.1016/j.matdes.2018.02.044

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JF - Materials and Design

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