Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

Mahesh Yalagach, Peter Filipp Fuchs, Thomas Antretter, Tao Qi, Markus Weber

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

OriginalspracheEnglisch
Titel2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
Seiten380-385
Seitenumfang6
ISBN (elektronisch)9781728189116
DOIs
PublikationsstatusVeröffentlicht - 2 Dez. 2020
Veranstaltung22nd IEEE Electronics Packaging Technology Conference, EPTC 2020 - Virtual, Singapore, Singapur
Dauer: 2 Dez. 20204 Dez. 2020

Publikationsreihe

Name2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020

Konferenz

Konferenz22nd IEEE Electronics Packaging Technology Conference, EPTC 2020
Land/GebietSingapur
OrtVirtual, Singapore
Zeitraum2/12/204/12/20

Bibliographische Notiz

Funding Information:
ACKNOWLEDGMENT The research work was performed within the K-Project "PolyTherm" at the Polymer Competence Center Leoben GmbH (PCCL, Austria) within the framework of the COMETprogram of the Federal Ministry for Transport, Innovation and Technology and the Federal Ministry for Digital and Economic Affairs with contributions by University of Leoben, ams AG and by AT&S Austria Technologie & Systemtechnik Aktiengesellschaft. Funding is provided by the Austrian Government and the State Government of Styria.

Publisher Copyright:
© 2020 IEEE.

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