Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

Mahesh Yalagach; Peter Filipp Fuchs; Thomas Antretter; Tao Qi; Markus Weber

doi:10.1109/EPTC50525.2020.9315091

Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

Mahesh Yalagach
, Peter Filipp Fuchs
, Thomas Antretter
, Tao Qi
, Markus Weber

Polymer Competence Center Leoben GmbH
AT & S Austria Technologie & Systemtechnik
Austria-Mikro-Syst.-Intl. GmbH

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Originalsprache	Englisch
Titel	2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020
Herausgeber (Verlag)	Institute of Electrical and Electronics Engineers
Seiten	380-385
Seitenumfang	6
ISBN (elektronisch)	9781728189116
DOIs	https://doi.org/10.1109/EPTC50525.2020.9315091
Publikationsstatus	Veröffentlicht - 2 Dez. 2020
Veranstaltung	22nd IEEE Electronics Packaging Technology Conference, EPTC 2020 - Virtual, Singapore, Singapur Dauer: 2 Dez. 2020 → 4 Dez. 2020

Publikationsreihe

Name	2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020

Konferenz

Konferenz	22nd IEEE Electronics Packaging Technology Conference, EPTC 2020
Land/Gebiet	Singapur
Ort	Virtual, Singapore
Zeitraum	2/12/20 → 4/12/20

Bibliographische Notiz

Funding Information:
ACKNOWLEDGMENT The research work was performed within the K-Project "PolyTherm" at the Polymer Competence Center Leoben GmbH (PCCL, Austria) within the framework of the COMETprogram of the Federal Ministry for Transport, Innovation and Technology and the Federal Ministry for Digital and Economic Affairs with contributions by University of Leoben, ams AG and by AT&S Austria Technologie & Systemtechnik Aktiengesellschaft. Funding is provided by the Austrian Government and the State Government of Styria.

Publisher Copyright:
© 2020 IEEE.

Zugriff auf Dokument

10.1109/EPTC50525.2020.9315091

Andere Dateien und Links

Verknüpfung zur Publikation in Scopus

Dieses zitieren

Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T., & Weber, M. (2020). Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions. in 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020 (S. 380-385). Artikel 9315091 (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EPTC50525.2020.9315091

Yalagach, Mahesh ; Fuchs, Peter Filipp ; Antretter, Thomas et al. / Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions. 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, 2020. S. 380-385 (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

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title = "Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions",

keywords = "advanced hygro-thermo-mechanical simulation, die deformation, four-point bending, Moisture diffusion, pressure sensor",

author = "Mahesh Yalagach and Fuchs, \{Peter Filipp\} and Thomas Antretter and Tao Qi and Markus Weber",

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Yalagach, M, Fuchs, PF, Antretter, T, Qi, T & Weber, M 2020, Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions. in 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020., 9315091, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020, Institute of Electrical and Electronics Engineers, S. 380-385, 22nd IEEE Electronics Packaging Technology Conference, EPTC 2020, Virtual, Singapore, Singapur, 2/12/20. https://doi.org/10.1109/EPTC50525.2020.9315091

Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions. / Yalagach, Mahesh; Fuchs, Peter Filipp; Antretter, Thomas et al.
2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, 2020. S. 380-385 9315091 (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

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KW - four-point bending

KW - Moisture diffusion

KW - pressure sensor

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DO - 10.1109/EPTC50525.2020.9315091

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PB - Institute of Electrical and Electronics Engineers

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Yalagach M, Fuchs PF, Antretter T, Qi T, Weber M. Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions. in 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers. 2020. S. 380-385. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020). doi: 10.1109/EPTC50525.2020.9315091