Numerical investigation of the process of embedding components into printed circuit boards

Martin Pletz, Raul Bermejo, Peter Supancic, Johannes Stahr, Mike Morianz

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

5 Zitate (Scopus)
OriginalspracheEnglisch
Titel2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011
DOIs
PublikationsstatusVeröffentlicht - 2011
Veranstaltung2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 - Linz, Österreich
Dauer: 18 Apr. 201120 Apr. 2011

Konferenz

Konferenz2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011
Land/GebietÖsterreich
OrtLinz
Zeitraum18/04/1120/04/11

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