Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Begutachtung

5 Zitate (Scopus)

Originalsprache	Englisch
Seiten (von - bis)	148-155
Fachzeitschrift	Microelectronics Reliability
Publikationsstatus	Veröffentlicht - 2016

Dieses zitieren

@article{8ae450ab7d3f424ba86b0a7bb25785ba,

title = "Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads",

author = "Klaus Fellner and Thomas Antretter and Fuchs, \{Peter Filipp\} and Qi Tao",

year = "2016",

language = "English",

pages = "148--155",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Ltd",

}