Optimum Chip-Tape Adhesion for Reliable Pickup Process

Marko Omazic; Daniel Tscharnuter; Gernot Oreski; Michael Pinczolits; Nika Nikac; Andreas Rappmund; Matko Erceg; Gerald Pinter

doi:10.1109/TCPMT.2017.2744603

Optimum Chip-Tape Adhesion for Reliable Pickup Process

Marko Omazic, Daniel Tscharnuter, Gernot Oreski, Michael Pinczolits, Nika Nikac, Andreas Rappmund, Matko Erceg, Gerald Pinter

Lehrstuhl für Werkstoffkunde und Prüfung der Kunststoffe (210)

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Begutachtung

1 Zitat (Scopus)

Originalsprache	Englisch
Seiten (von - bis)	2057-2065
Seitenumfang	9
Fachzeitschrift	IEEE Transactions on Components, Packaging and Manufacturing Technology
Jahrgang	7.2017
Ausgabenummer	12
DOIs	https://doi.org/10.1109/TCPMT.2017.2744603
Publikationsstatus	Veröffentlicht - 19 Sept. 2017

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10.1109/TCPMT.2017.2744603

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Link to publication in Scopus

Dieses zitieren

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title = "Optimum Chip-Tape Adhesion for Reliable Pickup Process",

keywords = "Accumulated chip stress, adhesive energy, Adhesives, dicing tape, Integrated circuits, pickup process, Polymers, Radiation effects, Silicon, Stress, Substrates, UV-irradiation process.",

author = "Marko Omazic and Daniel Tscharnuter and Gernot Oreski and Michael Pinczolits and Nika Nikac and Andreas Rappmund and Matko Erceg and Gerald Pinter",

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T1 - Optimum Chip-Tape Adhesion for Reliable Pickup Process

AU - Omazic, Marko

AU - Tscharnuter, Daniel

AU - Oreski, Gernot

AU - Pinczolits, Michael

AU - Nikac, Nika

AU - Rappmund, Andreas

AU - Erceg, Matko

AU - Pinter, Gerald

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KW - Accumulated chip stress

KW - adhesive energy

KW - Adhesives

KW - dicing tape

KW - Integrated circuits

KW - pickup process

KW - Polymers

KW - Radiation effects

KW - Silicon

KW - Stress

KW - Substrates

KW - UV-irradiation process.

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JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

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