@article{ba24281f1f1f4823a60889db0c56267b,
title = "Optimum Chip-Tape Adhesion for Reliable Pickup Process",
keywords = "Accumulated chip stress, adhesive energy, Adhesives, dicing tape, Integrated circuits, pickup process, Polymers, Radiation effects, Silicon, Stress, Substrates, UV-irradiation process.",
author = "Marko Omazic and Daniel Tscharnuter and Gernot Oreski and Michael Pinczolits and Nika Nikac and Andreas Rappmund and Matko Erceg and Gerald Pinter",
year = "2017",
month = sep,
day = "19",
doi = "10.1109/TCPMT.2017.2744603",
language = "English",
volume = "7.2017",
pages = "2057--2065",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
issn = "2156-3950",
publisher = "Institute of Electrical and Electronics Engineers",
number = "12",
}