Pavement Macrotexture Evaluation for Tire Test Benches using Surface Profile Measurements

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Originalsprache	Englisch
Titel	2022 IEEE International Instrumentation and Measurement Technology Conference
Herausgeber (Verlag)	Publ by IEEE
ISBN (elektronisch)	978-1-6654-8360-5
DOIs	https://doi.org/10.1109/I2MTC48687.2022.9806594
Publikationsstatus	Veröffentlicht - 2022
Veranstaltung	2022 IEEE International Instrumentation and Measurement Technology Conference : I2MTC 2022 - Ottawa, Kanada Dauer: 16 Mai 2022 → 19 Mai 2022

Konferenz	2022 IEEE International Instrumentation and Measurement Technology Conference
Kurztitel	I2MTC 2022
Land/Gebiet	Kanada
Ort	Ottawa
Zeitraum	16/05/22 → 19/05/22

Zugriff auf Dokument

@inproceedings{14ad0164279b475292b6accfe4443c7b,

title = "Pavement Macrotexture Evaluation for Tire Test Benches using Surface Profile Measurements",

author = "Johannes Handler and Paul O'Leary",

year = "2022",

doi = "10.1109/I2MTC48687.2022.9806594",

language = "English",

booktitle = "2022 IEEE International Instrumentation and Measurement Technology Conference",

publisher = "Publ by IEEE",

note = "2022 IEEE International Instrumentation and Measurement Technology Conference ; Conference date: 16-05-2022 Through 19-05-2022",

}

Handler, J & O'Leary, P 2022, Pavement Macrotexture Evaluation for Tire Test Benches using Surface Profile Measurements. in 2022 IEEE International Instrumentation and Measurement Technology Conference. Publ by IEEE, 2022 IEEE International Instrumentation and Measurement Technology Conference , Ottawa, Quebec, Kanada, 16/05/22. https://doi.org/10.1109/I2MTC48687.2022.9806594

TY - GEN

T1 - Pavement Macrotexture Evaluation for Tire Test Benches using Surface Profile Measurements

AU - Handler, Johannes

AU - O'Leary, Paul

PY - 2022

Y1 - 2022

U2 - 10.1109/I2MTC48687.2022.9806594

DO - 10.1109/I2MTC48687.2022.9806594

M3 - Conference contribution

BT - 2022 IEEE International Instrumentation and Measurement Technology Conference

PB - Publ by IEEE

T2 - 2022 IEEE International Instrumentation and Measurement Technology Conference

Y2 - 16 May 2022 through 19 May 2022

ER -