Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

Christian Schipfer, Mario Gschwandl, Peter Fuchs, Thomas Antretter, Michael Feuchter, Matthias Morak, Qi Tao, Angelika Schingale

Publikation: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

OriginalspracheEnglisch
Titel2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
ISBN (elektronisch)9781665413732
ISBN (Print)9781665413732
DOIs
PublikationsstatusVeröffentlicht - 19 Apr. 2021
Veranstaltung22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 - St. Julian, Malta
Dauer: 19 Apr. 202121 Apr. 2021

Publikationsreihe

Name2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

Konferenz

Konferenz22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
Land/GebietMalta
OrtSt. Julian
Zeitraum19/04/2121/04/21

Bibliographische Notiz

Funding Information:
The research work was performed within the K-Project "PolyTherm" at the Polymer Competence Center Leoben COMET-program of the Federal Ministry for Transport, Innovation and Technology and the Federal Ministry for Digital and Economic Affairs with contributions by the Montanuniversitaet of Leoben, TU Dortmund University, AT&S Austria Technologie & Systemtechnik Aktienge-sellschaft and by Vitesco Technologies. Funding is provided by the Austrian Government and the State Government of Styria.

Publisher Copyright:
© 2021 IEEE.

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