Originalsprache | Englisch |
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Titel | 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 |
Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers |
ISBN (elektronisch) | 9781665413732 |
ISBN (Print) | 9781665413732 |
DOIs | |
Publikationsstatus | Veröffentlicht - 19 Apr. 2021 |
Veranstaltung | 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 - St. Julian, Malta Dauer: 19 Apr. 2021 → 21 Apr. 2021 |
Publikationsreihe
Name | 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 |
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Konferenz
Konferenz | 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 |
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Land/Gebiet | Malta |
Ort | St. Julian |
Zeitraum | 19/04/21 → 21/04/21 |
Bibliographische Notiz
Funding Information:The research work was performed within the K-Project "PolyTherm" at the Polymer Competence Center Leoben COMET-program of the Federal Ministry for Transport, Innovation and Technology and the Federal Ministry for Digital and Economic Affairs with contributions by the Montanuniversitaet of Leoben, TU Dortmund University, AT&S Austria Technologie & Systemtechnik Aktienge-sellschaft and by Vitesco Technologies. Funding is provided by the Austrian Government and the State Government of Styria.
Publisher Copyright:
© 2021 IEEE.