Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

Christian Schipfer; Mario Gschwandl; Peter Fuchs; Thomas Antretter; Michael Feuchter; Matthias Morak; Qi Tao; Angelika Schingale

doi:10.1109/EuroSimE52062.2021.9410855

Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

Christian Schipfer
, Mario Gschwandl
, Peter Fuchs
, Thomas Antretter
, Michael Feuchter
, Matthias Morak
, Qi Tao
, Angelika Schingale

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Originalsprache	Englisch
Titel	2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
Herausgeber (Verlag)	Institute of Electrical and Electronics Engineers
ISBN (elektronisch)	9781665413732
ISBN (Print)	9781665413732
DOIs	https://doi.org/10.1109/EuroSimE52062.2021.9410855
Publikationsstatus	Veröffentlicht - 19 Apr. 2021
Veranstaltung	22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 - St. Julian, Malta Dauer: 19 Apr. 2021 → 21 Apr. 2021

Publikationsreihe

Name	2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

Konferenz

Konferenz	22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
Land/Gebiet	Malta
Ort	St. Julian
Zeitraum	19/04/21 → 21/04/21

Bibliographische Notiz

Funding Information:
The research work was performed within the K-Project "PolyTherm" at the Polymer Competence Center Leoben COMET-program of the Federal Ministry for Transport, Innovation and Technology and the Federal Ministry for Digital and Economic Affairs with contributions by the Montanuniversitaet of Leoben, TU Dortmund University, AT&S Austria Technologie & Systemtechnik Aktienge-sellschaft and by Vitesco Technologies. Funding is provided by the Austrian Government and the State Government of Styria.

Publisher Copyright:
© 2021 IEEE.

Zugriff auf Dokument

10.1109/EuroSimE52062.2021.9410855

Andere Dateien und Links

Dieses zitieren

Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q., & Schingale, A. (2021). Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics. in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 Artikel 9410855 (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE52062.2021.9410855

Schipfer, Christian ; Gschwandl, Mario ; Fuchs, Peter et al. / Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics. 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 2021. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

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Schipfer, C, Gschwandl, M, Fuchs, P, Antretter, T , Feuchter, M, Morak, M, Tao, Q & Schingale, A 2021, Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics. in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021., 9410855, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021, Institute of Electrical and Electronics Engineers, 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021, St. Julian, Malta, 19/04/21. https://doi.org/10.1109/EuroSimE52062.2021.9410855

Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics. / Schipfer, Christian; Gschwandl, Mario; Fuchs, Peter et al.
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 2021. 9410855 (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

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AU - Schipfer, Christian

AU - Gschwandl, Mario

AU - Fuchs, Peter

AU - Antretter, Thomas

AU - Feuchter, Michael

AU - Morak, Matthias

AU - Tao, Qi

AU - Schingale, Angelika

PY - 2021/4/19

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DO - 10.1109/EuroSimE52062.2021.9410855

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AN - SCOPUS:85105547315

SN - 9781665413732

T3 - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

BT - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

PB - Institute of Electrical and Electronics Engineers

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Schipfer C, Gschwandl M, Fuchs P, Antretter T , Feuchter M, Morak M et al. Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics. in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers. 2021. 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021). doi: 10.1109/EuroSimE52062.2021.9410855