Residual stresses and strains in thin films characterized by the combination of sin2ψ and substrate curvature methods

Titel in Übersetzung: Residual stresses and strains in thin films characterized by the combination of sin2ψ and substrate curvature methods

Klaus-Jürgen Martinschitz, Ernst Eiper, Jozef Keckes

Publikation: Konferenzbeitrag › Poster › Forschung › Begutachtung

Titel in Übersetzung	Residual stresses and strains in thin films characterized by the combination of sin2ψ and substrate curvature methods
Originalsprache	Englisch
Publikationsstatus	Veröffentlicht - 2006
Veranstaltung	Gordon Research Conference on thin film & small scale mechanical behavior 2006 - Waterville, USA / Vereinigte Staaten Dauer: 30 Juli 2006 → 4 Aug. 2006

Konferenz	Gordon Research Conference on thin film & small scale mechanical behavior 2006
Land/Gebiet	USA / Vereinigte Staaten
Ort	Waterville
Zeitraum	30/07/06 → 4/08/06

Dieses zitieren

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title = "Residual stresses and strains in thin films characterized by the combination of sin2ψ and substrate curvature methods",

author = "Klaus-J{\"u}rgen Martinschitz and Ernst Eiper and Jozef Keckes",

year = "2006",

language = "English",

note = "Gordon Research Conference on thin film & small scale mechanical behavior ; Conference date: 30-07-2006 Through 04-08-2006",

}

Residual stresses and strains in thin films characterized by the combination of sin2ψ and substrate curvature methods. / Martinschitz, Klaus-Jürgen; Eiper, Ernst; Keckes, Jozef.
2006. Postersitzung präsentiert bei Gordon Research Conference on thin film & small scale mechanical behavior 2006, Waterville, Maine, USA / Vereinigte Staaten.

Publikation: Konferenzbeitrag › Poster › Forschung › Begutachtung