Revealing dynamic-mechanical properties of precipitates in a nanostructured thin film using micromechanical spectroscopy

Publikation: Beitrag in FachzeitschriftArtikelForschungBegutachtung

Abstract

Nanostructured materials with their remarkable properties are key enablers in many modern applications. For example, industrial dry-milling processes would not be as widely spread without the use of hard, wear-resistant metal nitride coatings to protect the cutting tools. However, improving these nanostructured thin films with regard to dynamical properties is demanding as probing respective parameters of (sub-)micron layers without any substrate influence is still challenging. To extend the scientific toolbox for such spatially confined systems, a novel methodological approach based on resonance peak measurements of a cantilever-transducer system termed micromechanical spectroscopy (µMS) is developed and applied to a Al0.8Cr0.2N model system. The mainly wurtzite type supersaturated Al0.8Cr0.2N system showed precipitation of cubic CrN at grain boundaries and local Cr variations upon annealing at 1050°C. This was accompanied by an increase in the previously unknown damping capability of 63 percent and an increase in Young’s modulus by 36 percent.
OriginalspracheEnglisch
Seiten (von - bis)49-58
FachzeitschriftMRS Bulletin
Jahrgang2024
Ausgabenummer49
DOIs
PublikationsstatusVeröffentlicht - 2024

Bibliographische Notiz

Funding Information:
This project has received funding from the European Research Council (ERC) under the European Union’s Horizon 2020 research and innovation programme (Grant No. 771146 TOUGHIT). The CzechNanoLab project LM2018110 funded by MEYS CR is gratefully acknowledged for the financial support of the measurements/sample fabrication at CEITEC Nano Research Infrastructure. Experimental support with the x-ray equipment by J. Todt, the nanoindentation equipment by V. Maier-Kiener, and the transmission electron microscopy investigations by J. Zalesak are gratefully acknowledged.

Publisher Copyright:
© 2023, The Author(s).

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