Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards

Katerina Macurova; Paul Angerer; Thomas Antretter; Raul Bermejo Moratinos; Wilson Maia; Ronald Schöngrundner; Thomas Krivec; Mike Morianz; Michel Brizoux

Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards

Katerina Macurova
, Paul Angerer
, Thomas Antretter
, Raul Bermejo Moratinos
, Wilson Maia
, Ronald Schöngrundner
, Thomas Krivec
, Mike Morianz
, Michel Brizoux

Materials Center Leoben Forschungs GmbH
AT&S - Austria Technologie & Systemtechnik Aktiengesselschaft Leoben
Thales

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

7 Zitate (Scopus)

Originalsprache	Englisch
Titel	Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
Herausgeber (Verlag)	G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger
ISBN (Print)	978-1-4799-4791-1
Publikationsstatus	Veröffentlicht - 2014

Dieses zitieren

Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M., & Brizoux, M. (2014). Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards. in Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger.

Macurova, Katerina ; Angerer, Paul ; Antretter, Thomas et al. / Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards. Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger, 2014.

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title = "Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards",

author = "Katerina Macurova and Paul Angerer and Thomas Antretter and \{Bermejo Moratinos\}, Raul and Wilson Maia and Ronald Sch{\"o}ngrundner and Thomas Krivec and Mike Morianz and Michel Brizoux",

year = "2014",

language = "English",

isbn = "978-1-4799-4791-1",

booktitle = "Proceedings of the 15th International Conference on Thermal, Mechanical \& Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014",

publisher = "G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger",

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Macurova, K, Angerer, P, Antretter, T , Bermejo Moratinos, R, Maia, W, Schöngrundner, R, Krivec, T, Morianz, M & Brizoux, M 2014, Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards. in Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger.

Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards. / Macurova, Katerina; Angerer, Paul; Antretter, Thomas et al.
Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger, 2014.

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

TY - GEN

T1 - Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards

AU - Macurova, Katerina

AU - Angerer, Paul

AU - Antretter, Thomas

AU - Bermejo Moratinos, Raul

AU - Maia, Wilson

AU - Schöngrundner, Ronald

AU - Krivec, Thomas

AU - Morianz, Mike

AU - Brizoux, Michel

PY - 2014

Y1 - 2014

M3 - Conference contribution

SN - 978-1-4799-4791-1

BT - Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014

PB - G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger

ER -

Macurova K, Angerer P, Antretter T , Bermejo Moratinos R, Maia W, Schöngrundner R et al. Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards. in Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. G.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger. 2014