Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads

Titel in Übersetzung: Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads

Publikation: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Titel in Übersetzung	Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads
Originalsprache	Englisch
Titel	13th Youth Symposium on Experimental Solid Mechanics
Seiten	29-32
Publikationsstatus	Veröffentlicht - 2014

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@inproceedings{811087ef38d84b00aef59c8c585565a2,

title = "Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads",

author = "Klaus Fellner and Peter Fuchs and Gerald Pinter",

year = "2014",

language = "English",

pages = "29--32",

booktitle = "13th Youth Symposium on Experimental Solid Mechanics",

}