@article{c864fc045f0e4659ada9ae50274e6d27,
title = "Stress and Deflection Development During Die Embedding into Printed Circuit Boards",
author = "Katerina Macurova and Paul Angerer and Raul Bermejo and Martin Pletz and Ronald Sch{\"o}ngrundner and Thomas Antretter and Thomas Krivec and Mike Morianz and Michel Brizoux and A. Lecavelier",
year = "2015",
doi = "10.1016/j.matpr.2015.09.003",
language = "Undefined/Unknown",
volume = "2",
pages = "4196--4205",
journal = "Materials Today: Proceedings",
publisher = "Elsevier Ltd",
number = "2",
}