Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films

H. Turnow; Horst Wendrock; Siegfried Menzel; Thomas Gemming; Jürgen Eckert

doi:10.1016/j.tsf.2015.10.081

Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films

H. Turnow
, Horst Wendrock
, Siegfried Menzel
, Thomas Gemming
, Jürgen Eckert

Lehrstuhl für Materialphysik (430)

IFW Dresden
Erich-Schmid-Institut für Materialwissenschaft der Österreichischen Akademie der Wissenschaften

Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Begutachtung

7 Zitate (Scopus)

Abstract

Thin film metallic glasses (TFMG) can possess a variety of advantages against crystalline thin metal films. High strength and toughness as well as specific corrosion resistivity are features, which can be widely used in MEMS (micro-electromechanical systems), lab-on-a-chip or surface acoustic wave (SAW) device applications. Amongst others, the Cu-Ti binary alloy system is known for having a moderate glass forming ability (GFA) in mid-composition range. In the present study a systematic characterization of sputter deposited Cu-Ti thin films in dependence on the chemical composition is carried out. Intrinsic stress, Young's modulus, surface roughness and electrical resistivity are discussed with respect to the present phases and microstructure. Especially the films within the amorphous range from 25 to 75 at.% Cu exhibit favorable mechanical properties.

Originalsprache	Englisch
Seiten (von - bis)	184-188
Seitenumfang	5
Fachzeitschrift	Thin solid films
Jahrgang	2016
Ausgabenummer	Volume 598, 1 January
Frühes Online-Datum	10 Nov. 2015
DOIs	https://doi.org/10.1016/j.tsf.2015.10.081
Publikationsstatus	Veröffentlicht - 1 Jan. 2016

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10.1016/j.tsf.2015.10.081

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title = "Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films",

abstract = "Thin film metallic glasses (TFMG) can possess a variety of advantages against crystalline thin metal films. High strength and toughness as well as specific corrosion resistivity are features, which can be widely used in MEMS (micro-electromechanical systems), lab-on-a-chip or surface acoustic wave (SAW) device applications. Amongst others, the Cu-Ti binary alloy system is known for having a moderate glass forming ability (GFA) in mid-composition range. In the present study a systematic characterization of sputter deposited Cu-Ti thin films in dependence on the chemical composition is carried out. Intrinsic stress, Young's modulus, surface roughness and electrical resistivity are discussed with respect to the present phases and microstructure. Especially the films within the amorphous range from 25 to 75 at.\% Cu exhibit favorable mechanical properties.",

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AU - Menzel, Siegfried

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AU - Eckert, Jürgen

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AB - Thin film metallic glasses (TFMG) can possess a variety of advantages against crystalline thin metal films. High strength and toughness as well as specific corrosion resistivity are features, which can be widely used in MEMS (micro-electromechanical systems), lab-on-a-chip or surface acoustic wave (SAW) device applications. Amongst others, the Cu-Ti binary alloy system is known for having a moderate glass forming ability (GFA) in mid-composition range. In the present study a systematic characterization of sputter deposited Cu-Ti thin films in dependence on the chemical composition is carried out. Intrinsic stress, Young's modulus, surface roughness and electrical resistivity are discussed with respect to the present phases and microstructure. Especially the films within the amorphous range from 25 to 75 at.% Cu exhibit favorable mechanical properties.

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