Thermal expansion of Ti-Al-N and Cr-Al-N coatings

Matthias Bartosik, David Holec, D. Apel, M. Klaus, Christoph Genzel, Jozef Keckes, Mirjam Arndt, Peter Polcik, Christian Martin Koller, Paul Heinz Mayrhofer

Publikation: Beitrag in FachzeitschriftArtikelForschungBegutachtung

36 Zitate (Scopus)


The thermal expansion coefficients (TECs) of B1 structured Ti1 − xAlxN and Cr1 − xAlxN thin films – investigated by synchrotron X-ray diffraction from room temperature to 600 °C – excellently agree with ab initio obtained temperature dependent calculations only if they were annealed at 600 °C. As-deposited thin films, with their built-in structural defects show a lower temperature dependence of their TECs and higher values. Furthermore, our data clearly show that the TECs of cubic Ti1 − xAlxN and Cr1 − xAlxN increase with increasing Al content, and that the TEC of wurtzite type B4 structured AlN is only about half of that of B1 AlN.
Seiten (von - bis)182-185
FachzeitschriftScripta materialia
Ausgabenummer15 January
PublikationsstatusVeröffentlicht - 2017


  • Thermal expansion
  • TiN
  • CrN
  • Ti-Al-N
  • Cr-Al-N
  • AlN
  • Ab initio

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